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MCP131X/2X
Voltage Supervisor
Features
* Low supply current: 1 A (typ.), 10 A (max.) * Precision monitoring trip point options: - 2.9V and 4.6V (Standard Offerings) - 2.0V to 4.7V in 100 mV increments, (Contact the local Microchip Sales Office) * Resets microcontroller in a power-loss event * Reset Delay Time Out Option: - 1.4 ms, 30 ms, 200 ms, or 1.6s (typ.) * Watchdog Timer Input Time Out Options: - 6.3 ms, 102 ms, 1.6s or 25.6s (typ.) * Manual Reset (MR) input (active-low) * Single and complementary Reset output(s) * Reset Output Options: - Push-Pull (active-high or active-low) - Open-Drain (internal or external Pull-up) * Temperature Range: -40C to +125C * Voltage Range: 1.0V to 5.5V * Lead Free Packaging
Package Types
SOT-23-5
MCP1316/16M/20 MCP1317
RST VSS MR
1 2 3
5
VDD WDI
RST VSS
1 2 3
5
VDD WDI
4
MR
4
MCP1318/18M/21
MCP1319/19M/22
RST VSS RST
1 2 3
5
VDD
RST VSS
1 2 3
5
VDD
4
WDI
RST
4
MR
Block Diagram
VDD + - Comparator RST Reference Voltage Noise Filter Watchdog VSS Output Driver RST
Description
The MCP1316/16M/17/18/18M/19/19M/20/21/22 are voltage supervisor devices designed to keep a microcontroller in Reset until the system voltage has reached and stabilized at the proper level for reliable system operation. This sevice family also offers a Watchdog Timer to monitor system operation and a Manual Reset input. The table below shows the available features for these devices. MR WDI
Note: Features available depend on the device
Device Features
Reset Output A Device MCP1316 MCP1316M MCP1317 MCP1318 MCP1318M MCP1319 MCP1319M MCP1320 MCP1321 MCP1322 Type Push-Pull Open-Drain Push-Pull Push-Pull Open-Drain Push-Pull Open-Drain Open-Drain Open-Drain Open-Drain Pull-up Resistor -- Internal -- -- Internal -- Internal External External External Active Level Low Low High Low Low Low Low Low Low Low Reset Output B Type -- -- -- Push-Pull Push-Pull Push-Pull Push-Pull -- Push-Pull Push-Pull Pull-up Resistor -- -- -- -- -- -- -- -- -- -- Active Level -- -- -- High High High High -- High High WDI Input Yes Yes Yes Yes Yes No No Yes Yes No MR Input Yes Yes Yes No No Yes Yes Yes No Yes
(c) 2005 Microchip Technology Inc.
DS21985A-page 1
MCP131X/2X
1.0 ELECTRICAL CHARACTERISTICS
Notice: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.
Absolute Maximum Ratings
Supply Voltage (VDD to VSS) . . . . . . . . . . . . . . . . . . . . . . 7.0V Input current (VDD) . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 mA Output current (RST) . . . . . . . . . . . . . . . . . . . . . . . . . .10 mA Voltage on all inputs and outputs, except Open-Drain RST (with no internal pull-up resistor), w.r.t. VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.6V to (VDD + 1.0V) Voltage on Open-Drain RST (with no internal pull-up resistor) w.r.t. VSS . . -0.6V to 13.5V Storage temperature . . . . . . . . . . . . . . . . . . .-65C to +150C Ambient temp. with power applied . . . . . . . .-40C to +125C Maximum Junction temp. with power applied . . . . . . . . 150C Power Dissipation (TA 70C): 5-Pin SOT-23A .......................................................240 mW ESD protection on all pins .................................................. 4 kV
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP1320, MCP1321 and MCP1322), TA = -40C to +125C. Parameters Operating Voltage Range Specified VDD Value to VOUT Low Operating Current: Sym VDD VDD IDD Min 1.0 1.0 -- -- -- -- Note 1: 2: 3: 4: Typ -- -- 5 1 1 5 Max 5.5 -- 10 2 2 10 Units V V A A A A I RST = 10 A, V RST < 0.3V Watchdog Timer Active Watchdog Timer Inactive VDD < VTRIP Reset Delay Timer Active Conditions
5: 6:
Trip point is 1.5% from typical value. Trip point is 2.5% from typical value. Hysterysis is minimum = 1%, max = 6% at +25C. This specification allows this device to be used in PICmicro(R) microcontroller applications that require the In-Circuit Serial ProgrammingTM (ICSPTM) feature (see device-specific programming specifications for voltage requirements). The total time that the RST pin can be above the maximum device operational voltage (5.5V) is 100s. Current into the RST pin should be limited to 2 mA. It is recommended that the device operational temperature be maintained between 0C to +70C (+25C preferred). For additional information, refer to Figure 2-35. This parameter is established by characterization and is not 100% tested. Custom ordered voltage trip point; minimum order volume requirement. Information available upon request.
DS21985A-page 2
(c) 2005 Microchip Technology Inc.
MCP131X/2X
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP1320, MCP1321 and MCP1322), TA = -40C to +125C. Parameters VDD Trip Point MCP13XX-20 (Note 6) MCP13XX-21 (Note 6) MCP13XX-22 (Note 6) MCP13XX-23 (Note 6) MCP13XX-24 (Note 6) MCP13XX-25 (Note 6) MCP13XX-26 (Note 6) MCP13XX-27 (Note 6) MCP13XX-28 (Note 6) MCP13XX-29 MCP13XX-30 (Note 6) MCP13XX-31 (Note 6) MCP13XX-32 (Note 6) MCP13XX-33 (Note 6) Note 1: 2: 3: 4: Sym VTRIP Min 1.970 1.950 2.069 2.048 2.167 2.145 2.266 2.243 2.364 2.340 2.463 2.438 2.561 2.535 2.660 2.633 2.758 2.730 2.857 2.828 2.955 2.925 3.054 3.023 3.152 3.120 3.251 3.218 Typ 2.00 2.00 2.10 2.10 2.20 2.20 2.30 2.30 2.40 2.40 2.50 2.50 2.60 2.60 2.70 2.70 2.80 2.80 2.90 2.90 3.00 3.00 3.10 3.10 3.20 3.20 3.30 3.30 Max 2.030 2.050 2.132 2.153 2.233 2.255 2.335 2.358 2.436 2.460 2.538 2.563 2.639 2.665 2.741 2.768 2.842 2.870 2.944 2.973 3.045 3.075 3.147 3.178 3.248 3.280 3.350 3.383 Units V V V V V V V V V V V V V V V V V V V V V V V V V V V V Conditions TA = +25C (Note 1) TA = -40C to +85C (Note 2) TA = +25C (Note 1) TA = -40C to +85C (Note 2) TA = +25C (Note 1) TA = -40C to +85C (Note 2) TA = +25C (Note 1) TA = -40C to +85C (Note 2) TA = +25C (Note 1) TA = -40C to +85C (Note 2) TA = +25C (Note 1) TA = -40C to +125C (Note 2) TA = +25C (Note 1) TA = -40C to +125C (Note 2) TA = +25C (Note 1) TA = -40C to +125C (Note 2) TA = +25C (Note 1) TA = -40C to +125C (Note 2) TA = +25C (Note 1) TA = -40C to +125C (Note 2) TA = +25C (Note 1) TA = -40C to +125C (Note 2) TA = +25C (Note 1) TA = -40C to +125C (Note 2) TA = +25C (Note 1) TA = -40C to +125C (Note 2) TA = +25C (Note 1) TA = -40C to +125C (Note 2)
5: 6:
Trip point is 1.5% from typical value. Trip point is 2.5% from typical value. Hysterysis is minimum = 1%, max = 6% at +25C. This specification allows this device to be used in PICmicro(R) microcontroller applications that require the In-Circuit Serial ProgrammingTM (ICSPTM) feature (see device-specific programming specifications for voltage requirements). The total time that the RST pin can be above the maximum device operational voltage (5.5V) is 100s. Current into the RST pin should be limited to 2 mA. It is recommended that the device operational temperature be maintained between 0C to +70C (+25C preferred). For additional information, refer to Figure 2-35. This parameter is established by characterization and is not 100% tested. Custom ordered voltage trip point; minimum order volume requirement. Information available upon request.
(c) 2005 Microchip Technology Inc.
DS21985A-page 3
MCP131X/2X
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP1320, MCP1321 and MCP1322), TA = -40C to +125C. Parameters VDD Trip Point (Con't) MCP13XX-34 (Note 6) MCP13XX-35 (Note 6) MCP13XX-36 (Note 6) MCP13XX-37 (Note 6) MCP13XX-38 (Note 6) MCP13XX-39 (Note 6) MCP13XX-40 (Note 6) MCP13XX-41 (Note 6) MCP13XX-42 (Note 6) MCP13XX-43 (Note 6) MCP13XX-44 (Note 6) MCP13XX-45 (Note 6) MCP13XX-46 MCP13XX-47 (Note 6) VDD Trip Point Tempco Note 1: 2: 3: 4:
TTPCO
Sym VTRIP
Min 3.349 3.315 3.448 3.413 3.546 3.510 3.645 3.608 3.743 3.705 3.842 3.803 3.940 3.900 4.039 3.998 4.137 4.095 4.236 4.193 4.334 4.290 4.433 4.388 4.531 4.485 4.630 4.583
--
Typ 3.40 3.40 3.50 3.50 3.60 3.60 3.70 3.70 3.80 3.80 3.90 3.90 4.00 4.00 4.10 4.10 4.20 4.20 4.30 4.30 4.40 4.40 4.50 4.50 4.60 4.60 4.70 4.70
40
Max 3.451 3.385 3.553 3.588 3.654 3.690 3.756 3.793 3.857 3.895 3.959 3.998 4.060 4.100 4.162 4.203 4.263 4.305 4.365 4.408 4.466 4.510 4.568 4.613 4.669 4.715 4.771 4.818
--
Units V V V V V V V V V V V V V V V V V V V V V V V V V V V V
ppm/C
Conditions TA = +25C (Note 1) TA = -40C to +125C (Note 2) TA = +25C (Note 1) TA = -40C to +125C (Note 2) TA = +25C (Note 1) TA = -40C to +125C (Note 2) TA = +25C (Note 1) TA = -40C to +125C (Note 2) TA = +25C (Note 1) TA = -40C to +125C (Note 2) TA = +25C (Note 1) TA = -40C to +125C (Note 2) TA = +25C (Note 1) TA = -40C to +125C (Note 2) TA = +25C (Note 1) TA = -40C to +125C (Note 2) TA = +25C (Note 1) TA = -40C to +125C (Note 2) TA = +25C (Note 1) TA = -40C to +125C (Note 2) TA = +25C (Note 1) TA = -40C to +125C (Note 2) TA = +25C (Note 1) TA = -40C to +125C (Note 2) TA = +25C (Note 1) TA = -40C to +125C (Note 2) TA = +25C (Note 1) TA = -40C to +125C (Note 2)
5: 6:
Trip point is 1.5% from typical value. Trip point is 2.5% from typical value. Hysterysis is minimum = 1%, max = 6% at +25C. This specification allows this device to be used in PICmicro(R) microcontroller applications that require the In-Circuit Serial ProgrammingTM (ICSPTM) feature (see device-specific programming specifications for voltage requirements). The total time that the RST pin can be above the maximum device operational voltage (5.5V) is 100s. Current into the RST pin should be limited to 2 mA. It is recommended that the device operational temperature be maintained between 0C to +70C (+25C preferred). For additional information, refer to Figure 2-35. This parameter is established by characterization and is not 100% tested. Custom ordered voltage trip point; minimum order volume requirement. Information available upon request.
DS21985A-page 4
(c) 2005 Microchip Technology Inc.
MCP131X/2X
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP1320, MCP1321 and MCP1322), TA = -40C to +125C. Parameters Threshold Hysteresis (Note 3) MCP13XX-20 (Note 6) MCP13XX-21 (Note 6) MCP13XX-22 (Note 6) MCP13XX-23 (Note 6) MCP13XX-24 (Note 6) MCP13XX-25 (Note 6) MCP13XX-26 (Note 6) MCP13XX-27 (Note 6) MCP13XX-28 (Note 6) MCP13XX-29 MCP13XX-30 (Note 6) MCP13XX-31 (Note 6) MCP13XX-32 (Note 6) MCP13XX-33 (Note 6) Note 1: 2: 3: 4: VHYS 0.033 0.032 0.031 0.029 0.030 0.028 0.027 0.026 0.025 0.024 0.023 0.022 0.021 Sym VHYS Min 0.020 Typ -- (Note 6) -- (Note 6) -- (Note 6) -- (Note 6) -- (Note 6) -- (Note 6) -- (Note 6) -- (Note 6) -- (Note 6) -- (Note 6) -- (Note 6) -- (Note 6) -- (Note 6) -- (Note 6) 0.198 0.192 0.186 0.180 0.174 0.168 0.162 0.156 0.150 0.144 0.138 0.132 0.126 Max 0.120 Units V V V V V V V V V V V V V V V V V V V V V V V V V V V V Conditions TA = +25C (Note 3) TA = -40C to +85C TA = +25C (Note 3) TA = -40C to +85C TA = +25C (Note 3) TA = -40C to +85C TA = +25C (Note 3) TA = -40C to +85C TA = +25C (Note 3) TA = -40C to +85C TA = +25C (Note 3) TA = -40C to +125C TA = +25C (Note 3) TA = -40C to +125C TA = +25C (Note 3) TA = -40C to +125C TA = +25C (Note 3) TA = -40C to +125C TA = +25C (Note 3) TA = -40C to +125C TA = +25C (Note 3) TA = -40C to +125C TA = +25C (Note 3) TA = -40C to +125C TA = +25C (Note 3) TA = -40C to +125C TA = +25C (Note 3) TA = -40C to +125C
5: 6:
Trip point is 1.5% from typical value. Trip point is 2.5% from typical value. Hysterysis is minimum = 1%, max = 6% at +25C. This specification allows this device to be used in PICmicro(R) microcontroller applications that require the In-Circuit Serial ProgrammingTM (ICSPTM) feature (see device-specific programming specifications for voltage requirements). The total time that the RST pin can be above the maximum device operational voltage (5.5V) is 100s. Current into the RST pin should be limited to 2 mA. It is recommended that the device operational temperature be maintained between 0C to +70C (+25C preferred). For additional information, refer to Figure 2-35. This parameter is established by characterization and is not 100% tested. Custom ordered voltage trip point; minimum order volume requirement. Information available upon request.
(c) 2005 Microchip Technology Inc.
DS21985A-page 5
MCP131X/2X
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP1320, MCP1321 and MCP1322), TA = -40C to +125C. Parameters Threshold Hysteresis (Continued) (Note 3) MCP13XX-34 (Note 6) MCP13XX-35 (Note 6) MCP13XX-36 (Note 6) MCP13XX-37 (Note 6) MCP13XX-38 (Note 6) MCP13XX-39 (Note 6) MCP13XX-40 (Note 6) MCP13XX-41 (Note 6) MCP13XX-42 (Note 6) MCP13XX-43 (Note 6) MCP13XX-44 (Note 6) MCP13XX-45 (Note 6) MCP13XX-46 MCP13XX-47 (Note 6) Note 1: 2: 3: 4: VHYS 0.046 0.047 0.045 0.044 0.043 0.042 0.041 0.040 0.039 0.038 0.037 0.036 0.035 Sym Min 0.034 Typ -- (Note 6) -- (Note 6) -- (Note 6) -- (Note 6) -- (Note 6) -- (Note 6) -- (Note 6) -- (Note 6) -- (Note 6) -- (Note 6) -- (Note 6) -- (Note 6) -- (Note 6) -- (Note 6) 0.282 0.276 0.270 0.264 0.258 0.252 0.246 0.240 0.234 0.228 0.222 0.216 0.210 Max 0.204 Units V V V V V V V V V V V V V V V V V V V V V V V V V V V V Conditions TA = +25C (Note 3) TA = -40C to +125C TA = +25C (Note 3) TA = -40C to +125C TA = +25C (Note 3) TA = -40C to +125C TA = +25C (Note 3) TA = -40C to +125C TA = +25C (Note 3) TA = -40C to +125C TA = +25C (Note 1) TA = -40C to +125C TA = +25C (Note 3) TA = -40C to +125C TA = +25C (Note 3) TA = -40C to +125C TA = +25C (Note 3) TA = -40C to +125C TA = +25C (Note 3) TA = -40C to +125C TA = +25C (Note 3) TA = -40C to +125C TA = +25C (Note 3) TA = -40C to +125C TA = +25C (Note 3) TA = -40C to +125C TA = +25C (Note 3) TA = -40C to +125C
5: 6:
Trip point is 1.5% from typical value. Trip point is 2.5% from typical value. Hysterysis is minimum = 1%, max = 6% at +25C. This specification allows this device to be used in PICmicro(R) microcontroller applications that require the In-Circuit Serial ProgrammingTM (ICSPTM) feature (see device-specific programming specifications for voltage requirements). The total time that the RST pin can be above the maximum device operational voltage (5.5V) is 100s. Current into the RST pin should be limited to 2 mA. It is recommended that the device operational temperature be maintained between 0C to +70C (+25C preferred). For additional information, refer to Figure 2-35. This parameter is established by characterization and is not 100% tested. Custom ordered voltage trip point; minimum order volume requirement. Information available upon request.
DS21985A-page 6
(c) 2005 Microchip Technology Inc.
MCP131X/2X
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP1320, MCP1321 and MCP1322), TA = -40C to +125C. Parameters RST/RST Low-Level Output Voltage Sym VOL Min -- -- -- -- RST/RST High-Level Output Voltage (Push-Pull Outputs only) Input Low Voltage (MR and WDI pins) Input High Voltage (MR and WDI pins) Open-Drain High Voltage on Output (Note 4) VIL VIH VODH VOH VDD - 0.7 VDD - 0.7 VSS 0.7VDD -- Typ -- -- -- -- -- -- -- -- -- Max 0.3 0.3 0.3 0.3 -- -- 0.3VDD VDD 13.5 (4) Units V V V V V V V V V Open-Drain Output pin only, VDD = 3.0V, Time voltage > 5.5V applied 100 s, current into pin limited to 2 mA, +25C operation recommended (Note 4, Note 5) VSS VPIN VDD Conditions IOL = 50 A, 1.0V VDD 1.5V IOL = 100 A, 1.5V < VDD 2.5V IOL = 2 mA, 2.5V < VDD 4.5V IOL = 4 mA, VDD > 4.5V IOH = 2.5 mA, VDD 2.5V IOH = 500 A, VDD 1.5V
Input Leakage Current (MR and WDI) Open-Drain Output Leakage Current (MCP1316M, MCP1318M, MCP1319M, MCP1320, MCP1321 and MCP1322 only) Pull-up Resistance MR pin WDI pin RST pin Input Pin Capacitance (MR and WDI) Output Pin Capacitive Loading (RST and RST) Note 1: 2: 3: 4:
IIL IOD
-- --
-- 0.003
1 1.0
A A
RPU
-- -- --
52 52 4.7 100 --
-- -- -- -- 50
k k k pF pF
VDD = 5.5V VDD = 5.5V VDD = 5.5V, MCP131XM devices only This is the tester loading to meet the AC timing specifications.
CI CO
-- --
5: 6:
Trip point is 1.5% from typical value. Trip point is 2.5% from typical value. Hysterysis is minimum = 1%, max = 6% at +25C. This specification allows this device to be used in PICmicro(R) microcontroller applications that require the In-Circuit Serial ProgrammingTM (ICSPTM) feature (see device-specific programming specifications for voltage requirements). The total time that the RST pin can be above the maximum device operational voltage (5.5V) is 100s. Current into the RST pin should be limited to 2 mA. It is recommended that the device operational temperature be maintained between 0C to +70C (+25C preferred). For additional information, refer to Figure 2-35. This parameter is established by characterization and is not 100% tested. Custom ordered voltage trip point; minimum order volume requirement. Information available upon request.
(c) 2005 Microchip Technology Inc.
DS21985A-page 7
MCP131X/2X
VTRIPMAX VTRIPAC + VHYS VTRIPMIN VDD tRR RST 1V VTRIP tRST tRST
tRPD
RST
VDD < 1V is outside the device operating specification. The RST (or RST) output state is unknown while VDD < 1V.
FIGURE 1-1: TABLE 1-1:
Device Voltage and Reset Pin Waveforms. DEVICE VOLTAGE AND RESET PIN TIMINGS
Electrical Specifications: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP1320, MCP1321 and MCP1322), TA = -40C to +125C. Parameters Falling VDD Trip Point Detected to RST or RST Active Sym tRPD Min -- Typ 650 Max -- Units s Conditions VDD ramped from VTRIPMAX + 250 mV down to VTRIPMIN - 200 mV, VDD falling @ 5 mV/s, CL = 50 pF (Note 1) Note 2 Note 2 Standard Time Out Note 2 For RST 10% to 90% of VDD, CL = 50 pF (Note 1) For RST 10% to 90% of VDD, CL = 50 pF (Note 1) For RST 90% to 10% of VDD, CL = 50 pF (Note 1) For RST 90% to 10% of VDD, CL = 50 pF (Note 1)
VDD Rise Rate Reset active time (MR Rising Edge, POR/BOR Inactive, or WDT time out) to RST/RST Inactive RST Rise Time After RST Active (Push-Pull Outputs only) RST Rise Time After RST Inactive (Push-Pull Outputs only) RST Fall Time after RST Inactive RST Fall Time after RST Active Note 1: 2: 3:
tRR tRST 1.0 20 140 1120 tRT -- -- tFT -- --
Note 3 1.4 30 200 1600 5 5 5 5 2.0 40 280 2240 -- -- -- -- ms ms ms ms s s s s
These parameters are for design guidance only and are not 100% tested. Custom ordered Reset active time; minimum order volume requirement. Designed to be independent of VDD rise rate. Device characterization was done with a rise rate as slow as 0.1 V/s (@ +25C).
DS21985A-page 8
(c) 2005 Microchip Technology Inc.
MCP131X/2X
MR tMR tRST tNF RST tMRD
RST
FIGURE 1-2: TABLE 1-2:
MR and Reset Pin Waveforms. MR AND RESET PIN TIMINGS
Electrical Specifications: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP1320, MCP1321 and MCP1322), TA = -40C to +125C. Parameters MR Pulse Width MR Active to RST/RST Active MR Input Noise filter Note 1: Sym tMR tMRD tNF Min 1 -- -- Typ -- 235 150 Max -- -- -- Units s ns ns VDD = 5.0V VDD = 5.0V Conditions
These parameters are for design guidance only and are not 100% tested.
RST
RST WDI (Note 1) tRST tWD tWD
tWP
Note 1: The WDI pin was a weak pull-up resistor which is disabled after the 1st falling edge on the WDI pin.
FIGURE 1-3: TABLE 1-3:
WDI and Reset Pin Waveforms. WDI AND RESET PIN TIMINGS
Electrical Specifications: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP1320, MCP1321 and MCP1322), TA = -40C to +125C. Parameters WDI Pulse Width Watchdog Time Out Period Sym tWP tWD Min 50 4.3 71 1.12 17.9 Note 1: Typ -- 6.3 102 1.6 25.6 Max -- 9.3 153 2.4 38.4 Units ns ms ms sec sec Note 1 Note 1 Standard Time Out Note 1 Conditions
Custom ordered WatchDog Timer time out; minimum order volume requirement.
(c) 2005 Microchip Technology Inc.
DS21985A-page 9
MCP131X/2X
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP1316), TA = -40C to +125C. Parameters Temperature Ranges Specified Temperature Range Specified Temperature Range Maximum Junction Temperature Storage Temperature Range Package Thermal Resistances Thermal Resistance, 5L-SOT23 JA -- 255.9 -- C/W TA TA TJ TA -40 -40 -- -65 -- -- -- -- +85 +125 +150 +150 C C C C MCP13XX-25 (or below) Except MCP13XX-25 (or below) Sym Min Typ Max Units Conditions
DS21985A-page 10
(c) 2005 Microchip Technology Inc.
MCP131X/2X
2.0
Note:
TYPICAL PERFORMANCE CURVES
The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP1316; see Figure 4-1), TA = -40C to +125C.
1.2 1 IDD (A) 0.8 0.6 0.4 0.2 0 -100 Idd (uA)
4.8V 5.0V 5.5V
1.0V 3.0V 4.8V
1.5V 4.3V 5.0V
2.0V 4.5V 5.5V
6 5 4 3 2 1
-50
0
50
100
150
0 -100
-50
0
50
100
150
Temperature (C)
Temperature (C)
FIGURE 2-1: IDD vs. Temperature (Reset Power-up Timer Inactive and Watchdog Timer Inactive) (MCP1318M-4.6).
1.4 1.2 1 IDD (A) 0.8 0.6 0.4 0.2 0 -100 -50 0 50 100 150
1.0V 2.7V 4.5V 1.5V 3.2V 5.0V 2.5V 4.0V 5.5V
FIGURE 2-4: IDD vs. Temperature (Reset Power-up Timer Active) (MCP1318M-4.6).
3.2V
4.0V
4.5V
5.0V
5.5V
6 5 IDD (A) 4 3 2 1 0 -100 -50 0 50 100 150
Temperature (C)
Temperature (C)
FIGURE 2-2: IDD vs. Temperature (Reset Power-up Timer Inactive and Watchdog Timer Inactive) (MCP1319-2.9).
1.8 1.0V 1.5V 1.6 2.2V 2.5V 1.4 4.5V 5.0V 1.2 1 0.8 0.6 0.4 0.2 0 -100 -50
FIGURE 2-5: IDD vs. Temperature (Reset Power-up Timer Active) (MCP1319-2.9).
1.8V 4.0V 5.5V
7 6 5 IDD (A) 4 3 2 1
2.2V
2.5V
4.0V
4.5V
5.0V
5.5V
IDD (A)
0
50
100
150
0 -100
-50
0
50
100
150
Temperature (C)
Temperature (C)
FIGURE 2-3: IDD vs. Temperature (Reset Power-up Timer Inactive and Watchdog Timer Inactive) (MCP1316-2.0).
FIGURE 2-6: IDD vs. Temperature (Reset Power-up Timer Active) (MCP1316-2.0).
(c) 2005 Microchip Technology Inc.
DS21985A-page 11
MCP131X/2X
Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP1316; see Figure 4-1), TA = -40C to +125C.
4.8V 5.0V 5.5V
7 6 5 IDD (A) 4 3 2 1 0 -100 -50 0 50 100 150
Temperature (C)
FIGURE 2-7: IDD vs. Temperature (Watchdog Timer Active) (MCP1318M-4.6).
MCP1319 does not have a Watchdog Timer
FIGURE 2-8: IDD vs. Temperature (Watchdog Timer Active) (MCP1319-2.9).
2.2V 2.5V 4.0V 4.5V 5.0V 5.5V
7 6 5 IDD (A) 4 3 2 1 0 -100 -50 0 50 100 150
Temperature (C)
FIGURE 2-9: IDD vs. Temperature (Watchdog Timer Active) (MCP1316-2.0).
DS21985A-page 12
(c) 2005 Microchip Technology Inc.
MCP131X/2X
Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP1316; see Figure 4-1), TA = -40C to +125C.
1.2 1 IDD (A) 0.8 0.6 0.4 0.2 0 0.0 1.0 2.0 3.0 VDD (V) 4.0 5.0 6.0
130C 90C
-45C 25C 90C 130C
6 5 IDD (A) 4 3 2 1 0 4.6 4.8 5.0 VDD (V) 5.2 5.4 5.6
25C -45C
FIGURE 2-10: IDD vs. VDD (Reset Power-up Timer Inactive and Watchdog Timer Inactive) (MCP1318M-4.6).
FIGURE 2-13: IDD vs. VDD (Reset Power-up Timer Active or Watchdog Timer Active) (MCP1318M-4.6).
-45C 25C 90C 130C
1.4 1.2 1 IDD (A) 0.8 0.6 0.4 0.2 0 0.0 1.0 2.0 3.0 VDD (V) 4.0 5.0
130C 90C
6 5 IDD (A) 4 3 2 1 0
25C -45C
6.0
0.0
1.0
2.0
3.0 VDD (V)
4.0
5.0
6.0
FIGURE 2-11: IDD vs. VDD (Reset Power-up Timer Inactive and Watchdog Timer Inactive) (MCP1319-2.9).
FIGURE 2-14: IDD vs. VDD (Reset Power-up Timer Active or Watchdog Timer Active) (MCP1319-2.9).
-45C 25C 90C 130C
1.8 1.6 1.4 1.2 1 0.8 0.6 0.4 0.2 0 0.0 1.0 2.0 3.0 VDD (V) 4.0 5.0
130C 90C 25C -45C
7 6 5 IDD (A) 4 3 2 1
IDD (A)
6.0
0 2.0 3.0 4.0 VDD (V) 5.0 6.0
FIGURE 2-12: IDD vs. VDD (Reset Power-up Timer Inactive and Watchdog Timer Inactive) (MCP1316-2.0).
FIGURE 2-15: IDD vs. VDD (Reset Power-up Timer Active or Watchdog Timer Active) (MCP1316-2.0).
(c) 2005 Microchip Technology Inc.
DS21985A-page 13
MCP131X/2X
Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP1316; see Figure 4-1), TA = -40C to +125C.
4.800 4.750 VTRIP (V) 4.700 4.650 4.600 4.550 -50 0 50
VTRIP Up
VOL (V)
VHYST
4.0 3.9 3.8 3.7 3.6 3.5 3.4 3.3 VTRIP Down 3.2 3.1 3.0 100 150
1V
2V
3V
4.3V
4.5V
4.8V
5V
5.5V
0.16 0.14 0.12 0.1 0.08 0.06 0.04 0.02 0 0.00
VTRIP Hyst (%)
2.00
4.00
6.00
8.00
10.00
Temperature (C)
IOL (mA)
FIGURE 2-16: VTRIP and VHYST vs. Temperature (MCP1318M-4.6).
3.020 3.000 2.980 VTRIP (V) 2.960 2.940 2.920 2.900 2.880 -50 0 50 100 Temperature (C)
VTRIP Down VTRIP Up VHYST
FIGURE 2-19: (MCP1318M-4.6).
1V 2.5V
VOL vs. IOL
3.5 3.4 3.4 3.3 3.3 3.2 3.2 3.1 3.1 3.0 150
2.7V
3.2V
4V
4.5V
5V
5.5V
0.16 0.14 0.12 0.1 0.08 0.06 0.04 0.02 0 0.00
VTRIP Hyst (%)
VOL (V)
2.00
4.00
6.00
8.00
10.00
IOL (mA)
FIGURE 2-17: VTRIP and VHYST vs. Temperature (MCP1319-2.9).
2.050
VTRIP Up
FIGURE 2-20: (MCP1319-2.9).
3.0 2.5 2.0 1.5 1.0 VTRIP Hyst (%)
VOL vs. IOL
2.040 VTRIP (V) 2.030 2.020 2.010 2.000 1.990 -50 0 50 100 Temperature (C)
VTRIP Down VHYST
0.5 0.0 150
0.02 0.018 0.016 0.014 0.012 0.01 0.008 0.006 0.004 0.002 0 0.00
1V
VOL (V)
1.8V
0.05
0.10
0.15
0.20
0.25
IOL (mA)
FIGURE 2-18: VTRIP and VHYST vs. Temperature (MCP1316-2.0).
FIGURE 2-21: (MCP1316-2.0).
VOL vs. IOL
DS21985A-page 14
(c) 2005 Microchip Technology Inc.
MCP131X/2X
Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP1316; see Figure 4-1), TA = -40C to +125C.
0.14 0.12 0.1
VOL (V)
0.2 mA 0.15 mA
0.08 0.06 0.04 0.02 0 -50 0 50 Temperature (C) 100
0.1 mA 0.05 mA 0 mA
150
5 4.5 4 3.5 3 2.5 2 1.5 1 0.5 0 0.00
4.5V 4.3V
VOH (V)
3V 2V 1.5V
1.00
2.00
3.00 IOH (mA)
4.00
5.00
6.00
FIGURE 2-22: VOL vs. Temperature (MCP1318M-4.6 @ VDD = 4.5V).
0.25 0.2
VOL (V)
0.2 mA
FIGURE 2-25: VOH vs. IOH (MCP1318M-4.6 @ 25C).
6 5 4
VOH (V)
5.5V 5V 4.5V 4V 3.2V 2.7V 2.5V 1.5V
0.15 0.1 0.05 0 -50 0 50 Temperature (C) 100
0.15 mA 0.1 mA 0.05 mA 0 mA
3 2 1 0 0.00
150
1.00
2.00
3.00 IOH (mA)
4.00
5.00
6.00
FIGURE 2-23: VOL vs. Temperature (MCP1319-2.9 @ VDD = 2.7V).
0.016 0.014 0.012
VOL (V)
0.2 mA 0.15 mA 0.1 mA
FIGURE 2-26: VOH vs. IOH (MCP1319-2.9 @ 25C).
6 5 VOH (V) 4 3 2 1 0 0.00 1.00 2.00 3.00 IOH (mA) 4.00 5.00 6.00 2.2V 2.5V 5.5V 5V 4.5V 4V
0.01 0.008 0.006 0.004 0.002 0 -50 0 50 100 Temperature (C)
0.05 mA 0 mA
150
FIGURE 2-24: VOL vs. Temperature (MCP1316-2-0 @ VDD = 1.8V).
FIGURE 2-27: VOH vs. IOH (MCP1316-2.0 @ 25C).
(c) 2005 Microchip Technology Inc.
DS21985A-page 15
MCP131X/2X
Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP1316; see Figure 4-1), TA = -40C to +125C.
350 300 250
tRPD (s)
5V 5.5V
4.8 V 5V 5.5 V
230 225 220
tRPU (ms)
200 150 100 50 0 -100 -50 0 50 100 150
215 210 205 200 195 190 -100 -50 0 50 100 150
Temperature (C)
Temperature (C)
FIGURE 2-28: (MCP1318M-4.6).
3.2V
tRPD vs. Temperature
FIGURE 2-31: (MCP1318M-4.6).
3.2 V
tRPU vs. Temperature
4V
4.5V
5V
5.5V
4V
4.5 V
5V
5.5 V
450 400 350 300 250 200 150 100 50 0 -100
-50
0
50
100
150
250 245 240 235 230 225 220 215 210 205 200 -100
tRPD (s)
tRPU (ms)
-50
0
50
100
150
Temperature (C)
Temperature (C)
FIGURE 2-29: (MCP1319-2.9).
2.5V
tRPD vs. Temperature
FIGURE 2-32: (MCP1319-2.9).
2.5 V
tRPU vs. Temperature
4V
4.5V
5V
5.5V
4V
4.5 V
5V
5.5 V
2.2 V
350 300 200 150 100 50 0 -100 -50 0 50 100 150 tRPU (ms) 250 tRPD (s)
250 245 240 235 230 225 220 215 210 205 200 -100
-50
0
50
100
150
Temperature (C)
Temperature (C)
FIGURE 2-30: (MCP1316-2.0).
tRPD vs. Temperature
FIGURE 2-33: (MCP1316-2.0).
tRPU vs. Temperature
DS21985A-page 16
(c) 2005 Microchip Technology Inc.
MCP131X/2X
Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP1316; see Figure 4-1), TA = -40C to +125C.
VRST=2.0V VRST=2.9V VRST=4.6V
3500 Transient Duration (s) 3000 2500 2000 1500 1000 500 0 0.001 0.01 0.1 1 10 2.0V 2.9V
MCP1318M does not have a MR pin
Reset Threshold Overdrive (V) VTRIPMin - VDD
FIGURE 2-34: Transient Duration vs. VTRIP (min) - VDD.
2.2 V 2.5 V 4V 4.5 V 5V 5.5 V
FIGURE 2-36: MR Low to Reset Propagation Delay (MCP1318M-4.6).
3.2 V 4V 4.5 V 5V 5.5 V
Open-Drain Leakage (A)
0.012 0.01
tMRD (ns)
350 300 250 200 150 100 50 -50 0 50 100 150 0 -100 -50 0 50 100 150
0.008 0.006 0.004 0.002 0 -100
Temperature (C)
Temperature (C)
FIGURE 2-35: Open-Drain Leakage Current vs. Temperature (MCP1320-2.0).
FIGURE 2-37: MR Low to Reset Propagation Delay (MCP1319-2.9).
2.2 V 2.5 V 4V 4.5 V 5V 5.5 V
450 400 350 300 250 200 150 100 50 0 -100
tMRD (ns)
-50
0
50
100
150
Temperature (C)
FIGURE 2-38: MR Low to Reset Propagation Delay (MCP1316-2.0).
(c) 2005 Microchip Technology Inc.
DS21985A-page 17
MCP131X/2X
Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP1316; see Figure 4-1), TA = -40C to +125C.
1000 900 800 700 600 500 400 300 200 100 0 -100 0.145
Normalized Reset Timeout Period
0.14 0.135
MCP1318M-4.6
5V to 4.5V
tRPD (s)
0.13 0.125 0.12 -100
5V to 0V
-50
0
50
100
150
-50
0
50
100
150
Temperature (C)
Temperature (C)
FIGURE 2-39: VDD Falling to Reset Propagation Delay vs. Temperature (MCP1318M-4.6).
250 200
tRPD (s)
5V to 2.7V VTRIP Typ + 0.3V to VTRIP Min - 0.2V
FIGURE 2-42: Normalized Reset Time Out Period vs. Temperature (MCP1318M-4.6).
0.15
Normalized Reset Timeout Period
0.145 0.14
MCP1319-2.9
150 100 50 0 -100
0.135 0.13 0.125 -100
5V to 0V
-50
0
50
100
150
-50
0
50
100
150
Temperature (C)
Temperature (C)
FIGURE 2-40: VDD Falling to Reset Propagation Delay vs. Temperature (MCP1319-2.9).
250 200 tRPD (s) 150 100 50 0 -100
VTRIP Typ + 0.2V to VTRIP Min - 0.2V 5V to 0V 5V to 1.8V
FIGURE 2-43: Normalized Reset Time Out Period vs. Temperature (MCP1319-2.9).
0.15
Normalized Reset Timeout Period
0.145 0.14
MCP1316-2.0
0.135 0.13 0.125 -100
-50
0
50
100
150
Temperature (C)
-50 0 50 100 150 Temperature (C)
FIGURE 2-44: Normalized Reset Time Out Period vs. Temperature (MCP1316-2.0).
FIGURE 2-41: VDD Falling to Reset Propagation Delay vs. Temperature (MCP1316-2.0).
DS21985A-page 18
(c) 2005 Microchip Technology Inc.
MCP131X/2X
Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP1316; see Figure 4-1), TA = -40C to +125C.
1.25
Normalized Watchdog Timeout Period
Transient Duration (S)
VRST=2.0V VRST=2.9V VRST=4.6V
1.2 1.15 1.1 1.05 1 0.95 0.9 -100 -50 0 50 100 150
MCP1318M-4.6
600 500 400 300 200 100 0 0.001 0.01 0.1 1 10
Temperature (C)
Reset Threshold Overdrive (V) VTRIPMin - VDD
FIGURE 2-45: Normalized Watchdog Time Out Period vs. Temperature (MCP1318M-4.6).
FIGURE 2-48: Max VDD Transient Duration vs. Reset Threshold Overdrive.
MCP1319 does not have a Watchdog Timer
FIGURE 2-46: Normalized Watchdog Time Out Period vs. Temperature (MCP1319-2.9).
1.25
Normalized Watchdog Timeout Period
FIGURE 2-49: "M" Part # Pull-up Characteristics (MCP1318M-4.6).
1.2 1.15 1.1 1.05 1 0.95 0.9 -100 -50 0 50 100 150
MCP1316-2.0
Temperature (C)
FIGURE 2-47: Normalized Watchdog Time Out Period vs. Temperature (MCP1316-2.0).
(c) 2005 Microchip Technology Inc.
DS21985A-page 19
MCP131X/2X
3.0 PIN DESCRIPTION
PIN FUNCTION TABLE Device MCP1316M (1), MCP1318M (1), MCP1319M (1), MCP1320, MCP1321, MCP1322 Symbol RST Pin Type O Buffer/ Driver Type Function The descriptions of the pins are listed in Table 3-1. TABLE 3-1: Pin No. SOT23-5 1
Open-Drain Reset Output (active-low) Goes active (Low) if one of these conditions occurs: 1. If VDD falls below the selected Reset voltage threshold. 2. If the MR pin is forced low. 3. If the WDI pin does not detect an edge transition within the minimum selected time out period. 4. During power-up. VDD Falling: Open-Drain = VDD > VTRIP L = VDD < VTRIP VDD Rising: Open-Drain = VDD > VTRIP + VHYS L = VDD < VTRIP + VHYS
MCP1316, MCP1318, MCP1319
O
Push-Pull
VDD Falling: H = VDD > VTRIP L = VDD < VTRIP VDD Rising: H = VDD > VTRIP + VHYS L = VDD < VTRIP + VHYS
MCP1317
RST
O
Push-Pull
Reset Output (active-high) Goes active (High) if one of these conditions occurs: 1. If VDD falls below the selected Reset voltage threshold. 2. If the MR pin is forced low. 3. If the WDI pin does not detect an edge transition within the minimum selected time out period. 4. During power-up. VDD Falling: H = VDD < VTRIP L = VDD > VTRIP VDD Rising: H = VDD < VTRIP + VHYS L = VDD > VTRIP + VHYS
2 Note 1:
All
VSS
--
P
The ground reference for the device.
Open-Drain output with internal pull-up resistor.
DS21985A-page 20
(c) 2005 Microchip Technology Inc.
MCP131X/2X
TABLE 3-1: Pin No. SOT23-5 3 Device MCP1316, MCP1316M, MCP1317, MCP1320 Symbol MR PIN FUNCTION TABLE (CONTINUED) Pin Type I Buffer/ Driver Type ST Function Manual Reset input for a Reset switch. This input allows a push button switch to be directly connected to the MCP131X/2X MR pin, which can then be used to force a system Reset. This input filters (ignores) noise pulses that occur on the MR pin. L = Switch is depressed (shorted to ground). This forces the RST/RST pins Active. H = Switch is open (internal pull-up resistor pulls signal high). State of the RST/RST pins determined by other system conditions. Reset Output (active-high) Goes active (High) if one of these conditions occurs: 1. If VDD falls below the selected Reset voltage threshold. 2. If the MR pin is forced low. 3. If the WDI pin does not detect an edge transition within the minimum selected time out period. 4. During power-up. VDD Falling: H = VDD < VTRIP L = VDD > VTRIP VDD Rising: H = VDD < VTRIP + VHYS L = VDD > VTRIP + VHYS 4 MCP1316, MCP1316M, MCP1317, MCP1318, MCP1318M, MCP1320, MCP1321 MCP1319, MCP1319M, MCP1322 WDI I ST Watchdog Timer Input The WDT period is specified at the time of device order. The Standard WDT period is 1.6s typical. An edge transition on the WDI pin resets the Watchdog Timer counter (no time out). A Falling Edge is required to start the WDT Timer. Manual Reset input for a Reset switch. This input allows a push button switch to be directly connected to the MCP131X/2X MR pin, which can then be used to force a system Reset. This input filters (ignores) noise pulses that occur on the MR pin. L = Switch is depressed (shorted to ground). This forces the RST/RST pins Active. H = Switch is open (internal pull-up resistor pulls signal high). State of the RST/RST pins determined by other system conditions. The positive supply for the device.
MCP1318, MCP1318M, MCP1319, MCP1319M, MCP1321, MCP1322
RST
O
Push-Pull
MR
I
ST
5 Note 1:
All
VDD
--
P
Open-Drain output with internal pull-up resistor.
(c) 2005 Microchip Technology Inc.
DS21985A-page 21
MCP131X/2X
3.1 Ground Terminal (VSS) 3.4 Manual Reset Input (MR)
VSS provides the negative reference for the analog input voltage. Typically, the circuit ground is used. The Manual Reset (MR) input pin allows a push button switch to easily be connected to the system. When the push button is depressed, it forces a system Reset. This pin has circuitry that filters noise that may be present on the MR signal. The MR pin is active-low and has an internal pull-up resistor.
3.2
Supply Voltage (VDD)
VDD can be used for power supply monitoring or a voltage level that requires monitoring.
3.3
1. 2. 3. 4.
Reset Output (RST and RST)
Open-Drain active-low Reset, External pull-up resistor required Open-Drain active-low Reset, Internal pull-up resistor Push-Pull active-low Reset Push-Pull active-high Reset
3.5
Watchdog Input
There are four types of Reset output pins. These are:
In some systems, it is desirable to have an external Watchdog Timer to monitor the operation of the system. This is done by requiring the embedded controller to "pet" the Watchdog Timer within a predetermined time frame (TWD). If the MCP131X/2X is not "petted" within this time frame, the MCP131X/2X will force the Reset pin(s) active. The embedded controller "pets" the MCP131X/2X by forcing an edge transition on the WDI pin. The WDT Timer is activated by the first falling edge on the WDI pin. The standard offering devices have a typical Watchdog Timer period (TWD) of 1.6 s. Table 1-3 shows the available Watchdog Timer periods.
Some devices have both an active-low and active-high Reset output.
3.3.1
ACTIVE-LOW (RST) - OPEN-DRAIN, EXTERNAL PULL-UP RESISTOR
The RST open-drain output remains low while VDD is below the Reset voltage threshold (VTRIP). Once the device voltage (VDD) returns to a high level (VTRIP + VHYS), the device will remain in Reset for the Reset delay timer (TRST). After that time expires, the RST pin will float, and an external pull-up resistor is required to bring the output to the high state.
3.3.2
ACTIVE-LOW (RST) - OPEN-DRAIN, INTERNAL PULL-UP RESISTOR
The RST open-drain output remains low while VDD is below the Reset voltage threshold (VTRIP). Once the device voltage (VDD) returns to a high level (VTRIP + VHYS), the device will remain in Reset for the Reset delay timer (TRST). After that time expires, the RST pin will be pulled high by an internal pull-up resistor (typically 4.7 k).
3.3.3
ACTIVE-LOW (RST) - PUSH-PULL
The RST push-pull output remains low while VDD is below the Reset voltage threshold (VTRIP). Once the device voltage (VDD) returns to a high level (VTRIP + VHYS), the device will remain in Reset for the Reset delay timer (TRST). After that time expires, the RST pin will be driven to the high state.
3.3.4
ACTIVE-HIGH (RST) - PUSH-PULL
The RST push-pull output remains high while VDD is below the Reset voltage threshold (VTRIP). Once the device voltage (VDD) returns to a high level (VTRIP + VHYS), the device will remain in Reset for the Reset delay timer (TRST). After that time expires, the RST pin will be driven to the low state.
DS21985A-page 22
(c) 2005 Microchip Technology Inc.
MCP131X/2X
4.0 OPERATIONAL DESCRIPTION
For many of today's microcontroller applications, care must be taken to prevent low-power conditions that can cause many different system problems. The most common causes are brown-out conditions, where the system supply drops below the operating level momentarily. The second most common cause is when a slowly decaying power supply causes the microcontroller to begin executing instructions without sufficient voltage to sustain volatile memory (RAM), thus producing indeterminate results. Figure 4-1 shows a typical application circuit. The MCP131X/2X family is voltage supervisor devices designed to keep a microcontroller in Reset until the system voltage has reached and stabilized at the proper level for reliable system operation. These devices also operate as protection from brown-out conditions when the system supply voltage drops below a safe operating level. Some MCP131X/2X family members include a Watchdog Timer feature that after being enabled (by a falling edge on the WDI pin), monitors the WDI pin for falling edges. If an edge transition is not detected within the expected timeframe, the MCP131X/2X devices will force the Reset pin active. This is useful to ensure that the embedded system's Host Controller program is operating as expected. Some MCP131X/2X family members include a Manual Reset feature that allows a push button switch to be directly connected to the MCP131X/2X devices (on the MR pin). This allows the system to easily be reset from the external control of the push button switch. A superset block diagram is shown in Figure 4-2, with device specific block diagrams shown in Figure 4-3 through Figure 4-12. VDD VDD VDD RPU(1) PICmicro(R) Microcontroller MCLR (Reset input) (active-low) I/O VSS To system device that requires activehigh resets
0.1 F
MCP13XX
RST RST (2) MR VSS WDI
Push button switch
Note 1: Resistor RPU may be required with the MCP1320, MCP1321 or MCP1322 due to the open-drain output. Resistor RPU may not be required with the MCP1316M, MCP1318M or MCP1319M due to the internal pull-up resistor. The MCP1316, MCP1317, MCP1318 and MCP1319 do not require the external pull-up resistor. 2: Not all devices offer the active-high Reset output pin.
FIGURE 4-1:
Typical Application Circuit.
VDD
+ -
Comparator RST Reference Voltage Noise Filter Watchdog VSS Output Driver RST
MR WDI
Note: Features available depend on the device.
FIGURE 4-2:
Family Block Diagram
(c) 2005 Microchip Technology Inc.
DS21985A-page 23
MCP131X/2X
4.0.1 DEVICE SPECIFIC BLOCK DIAGRAMS
VDD + - Comparator Output Driver RST + - VDD Comparator RST Reference Voltage Output Driver RST
Reference Voltage Noise Filter Watchdog
MR WDI
VSS
WDI
Watchdog
VSS
FIGURE 4-3:
MCP1316 Block Diagram.
VDD
FIGURE 4-6:
MCP1318 Block Diagram.
VDD
+ -
Comparator Output Driver RST
+ -
Comparator RST Reference Voltage Output Driver RST
Reference Voltage Noise Filter Watchdog
MR WDI
VSS
WDI
Watchdog
VSS
FIGURE 4-4:
MCP1316M Block Diagram.
VDD
FIGURE 4-7:
MCP1318M Block Diagram.
+ -
Comparator Output Driver RST
Reference Voltage Noise Filter Watchdog
MR WDI
VSS
FIGURE 4-5:
MCP1317 Block Diagram.
DS21985A-page 24
(c) 2005 Microchip Technology Inc.
MCP131X/2X
VDD + - Comparator RST Reference Voltage Noise Filter VSS WDI Watchdog VSS Output Driver RST + - VDD Comparator Output Driver RST RST
Reference Voltage
MR
FIGURE 4-8:
MCP1319 Block Diagram.
VDD
FIGURE 4-11:
MCP1321 Block Diagram.
VDD
+ -
Comparator RST Reference Voltage Noise Filter VSS Output Driver RST
+ -
Comparator Output Driver RST RST
Reference Voltage Noise Filter
MR
MR
VSS
FIGURE 4-9:
.
MCP1319M Block Diagram.
VDD
FIGURE 4-12:
MCP1322 Block Diagram.
+ -
Comparator Output Driver RST
Reference Voltage Noise Filter Watchdog
MR WDI
VSS
FIGURE 4-10:
MCP1320 Block Diagram.
(c) 2005 Microchip Technology Inc.
DS21985A-page 25
MCP131X/2X
4.1 Reset Voltage Trip Point (VTRIP) Operation
The Reset pin (RST or RST) will be force active if any of the following occur: * * * * The Manual Reset input (MR) goes low The Watchdog Timer times out VDD goes below the threshold During device power up
The device's Reset voltage trip point (VTRIP) is selected when the device is ordered. As the voltage on the device's VDD pin is above or below this selected trip point, the output of the Reset pin (RST/RST) will be forced to either the inactive or active state. For the voltage trip point, there is a minimum trip voltage (VTRIPMIN) and a maximum trip voltage (VTRIPMAX). The voltage that the device "actually" trips at will be referred to as VTRIP. The trip voltage is specified for the falling of the device VDD. There is also a hysteresis (VHYS) on the trip point. This is so that noise on the device voltage (VDD) does not cause the Reset pin (RST/RST) to "jitter" (change between driving an active and inactive).
After the device exits the Reset condition, the delay circuitry will hold the RST and RST pins active until the appropriate Reset delay time (tRST) has elapsed.
TABLE 4-1:
Device
RESET PIN STATES
State of RST Pin when: VDD < VTRIP L L -- L L L L L L L VDD > VTRIP + VHYS H H
(2)
State of RST (3) Pin when: VDD < VTRIP -- -- H H H H H -- H H VDD > VTRIP + VHYS -- -- L L L L L -- L L Ouput Driver
MCP1316 MCP1316M MCP1317 MCP1318 MCP1318M MCP1319 MCP1319M MCP1320 MCP1321 MCP1322 Note 1: 2: 3:
Push-pull Open-drain (2) Push-pull Push-pull Open-drain (2) Push-pull Open-drain (2) Open-drain (1) Open-drain (1) Open-drain (1)
-- H H H
(2)
H
(2)
H (1) H (1) H (1)
Requires External Pull-up resistor. Has Internal Pull-up resistor. The RST pin output is always push-pull.
DS21985A-page 26
(c) 2005 Microchip Technology Inc.
MCP131X/2X
4.1.1 POWER-UP/RISING VDD 4.1.2 POWER-DOWN/BROWN-OUTS
As the device VDD rises, the device's Reset circuit will remain active until the voltage rises above the "actual" trip point (VTRIP) plus the hysteresis (VHYS). Figure 4-13 shows a power-up sequence and the waveform of the RST and RST pins. As the device powers up, the voltage will start below the valid operating voltage of the device. At this voltage, the Reset output value is not valid. Once the voltage is above the minimum operating voltage (1V) and below the selected VTRIP, the Reset output will be active. Once the device voltage rises above the "actual" trip point (VTRIP) plus the hysteresis (VHYS), the Reset delay timer (tRST) starts. When the Reset delay timer times out, the Reset output (RST/RST) is driven inactive. Note: While the Reset delay timer (tRST) is active, additional system current is consumed. As the device powers-down/brown-outs, the voltage (VDD) falls from a voltage above the devices trip point (VTRIP). The devices "actual" trip point voltage (VTRIP) will be between the minimum trip point (VTRIPMIN) and the maximum trip point (VTRIPMAX). Once the device voltage (VDD) goes below this voltage, the Reset pin(s) will be forced to the active state. There is a hysteresis on this trip point. This is so that noise on the device voltage (VDD) does not cause the Reset pin (RST/RST) to "jitter" (change between driving an active and inactive). Figure 4-14 shows the waveform of the RST pin as determined by the VDD voltage, while Table 4-1 shows the state of the RST pin.
4.1.2.1
Note:
Operation of RST pin with Internal Pull-Up Resistor
Only the MCP1316M, MCP1318M and MCP1319M devices have an open-drain RST output pin with an internal pull-up resistor.
VTRIPMIN VDD 1V
VTRIPMAX
VTRIP + VHYS tRST
The internal pull-up resistor has a typical value of 4.7 k. The internal pull-up eliminates the need for an external resistor. To reduce the current consumption of the device, when the RST pin is driving low, the resistor is disconnected.
VTRIP RST
RST
FIGURE 4-13: Power-up.
VDD
Reset pin Operation on a
VTRIPMAX VTRIPMIN 1V
VTRIP + VHYS VTRIP
VTRIP
RST tRPD < 1V is outside the device specifications
tRST tRPD
tRST
FIGURE 4-14:
RST Operation as determined by the VTRIP and VHYS.
(c) 2005 Microchip Technology Inc.
DS21985A-page 27
MCP131X/2X
4.2 Reset Delay Timer (tRST)
The Reset delay timer ensures that the MCP131X/2X device will "hold" the embedded system in Reset until the system voltage has stabilized. There are several time out options to better meet the requirements of different applications. These Reset delay timer time outs are shown in Table 4-2. The Standard offering time out is typically 200 ms. The Reset delay timer (tRST) starts after the device voltage rises above the "actual" trip point (VTRIP) plus the hysteresis (VHYS). When the Reset delay timer times out, the Reset output pin (RST/RST) is driven inactive. Note: While the Reset delay timer (tRST) is active, additional system current is consumed. Figure 4-15 illustrates when the Reset delay timer (tRST) is active or inactive. VDD VTRIP RST
tRST
Reset Delay Timer Active
TABLE 4-2:
RESET DELAY TIMER TIME OUTS (1)
tRST Typ 1.4 30 200 1.6 Max 2.0 40 280 2.24 This is the maximum time that the Reset delay timer will "hold" the Reset pin active after VDD rises above VTRIP + VHYS Units ms ms ms sec
Reset Delay Timer Inactive See Figures 2-12, 2-10 and 2-11
Reset Delay Timer Inactive
See Figures 2-12, 2-10 and 2-11
Min 1.0 20 140 1120 This is the minimum time that the Reset delay timer will "hold" the Reset pin active after VDD rises above VTRIP + VHYS Note 1:
See Figures 2-15, 2-14 and 2-13
FIGURE 4-15: Waveform. 4.2.1
Reset Power-up Timer
EFFECT OF TEMPERATURE ON RESET POWER-UP TIMER (TRPU)
The Reset delay timer time out period (tRST) determines how long the device remains in the Reset condition. This time out is affected by both the device VDD and temperature. Typical responses for different VDD values and temperatures are shown in Figures 2-33, 2-32 and 2-31.
Shaded rows are custom ordered time outs.
DS21985A-page 28
(c) 2005 Microchip Technology Inc.
MCP131X/2X
4.3 Negative Going VDD Transients 4.4 Manual Reset Input
The minimum pulse width (time) required to cause a Reset may be an important criteria in the implementation of a Power-on Reset (POR) circuit. This time is referred to as transient duration. The MCP131X/2X devices are designed to reject a level of negative-going transients (glitches) on the power supply line. Transient duration is the amount of time needed for these supervisory devices to respond to a drop in VDD. The transient duration time (tTRAN) is dependant on the magnitude of VTRIP - VDD (overdrive). Any combination of duration and overdrive that lies under the duration/overdrive curve will not generate a Reset signal. Generally speaking, the transient duration time decreases with and increases in the VTRIP - VDD voltage. Combinations of duration and overdrive that lies above the duration/overdrive curve are detected as a brown-out or power-down condition. Figure 4-16 shows a typical transient duration vs. Reset comparator overdrive, for which the MCP131X/2X will not generate a Reset pulse. It shows that the farther below the trip point the transient pulse goes, the duration of the pulse required to cause a Reset gets shorter. Figure 4-16 shows the transient response characteristics for the MCP131X/2X. Transient immunity can be improved by adding a bypass capacitor (typically 0.1 F) as close as possible to the VDD pin of the MCP131X/2X device. The Manual Reset input pin (MR) allows the Reset pins (RST/RST) to be manually forced to their active states. The MR pin has circuitry to filter noise pulses that may be present on the pin. Figure 4-17 shows a block diagram for using the MCP131X/2X with a push button switch. To minimize the required external components, the MR input has an internal pull-up resistor. A mechanical push button or active logic signal can drive the MR input. Once MR has been low for a time, tMRD (the Manual Reset delay time), the Reset output pins are forced active. The Reset output pins will remain in their active states for the Reset delay timer time out period (tRST) Figure 4-18 shows a waveform for the Manual Reset switch input and the Reset pins output. +5V VDD MR WDI I/O PICmicro(R) MCU MCLR
MCP13XX RST VSS
5V Supply Voltage VTRIP(MIN) - VDD (Overdrive) tTRANS (Duration) Time (s)
VTRIP(MAX) VTRIP(MIN)
FIGURE 4-17: Watchdog Timer.
Push Button Reset and
tMR MR tMRD VIH VIL RST RST tRST
0V
FIGURE 4-16: Example of Typical Transient Duration Waveform.
The MR input typically ignores input pulses of 100 ns.
FIGURE 4-18: 4.4.1
MR Input - Push Button.
NOISE FILTER
The noise filter filters out noise spikes (glitches) on the Manual Reset pin (MR). Noise spikes less than 100 ns (typical) are filtered.
(c) 2005 Microchip Technology Inc.
DS21985A-page 29
MCP131X/2X
4.5 Watchdog Timer
The purpose of the Watchdog Timer (WDT) is to increase system reliability. The Watchdog Timer feature can be used to detect when the Host Controller's program flow is not as expected. Since the Watchdog Timer monitors for activity on the Watchdog Input pin (WDI). The WDI pin is expected to be strobed within a given time frame. When this time frame is exceeded, without an edge transition on the WDI pin, the Reset pin is driven active to reset the system. This stops the Host Controller from continuing it's erratic behavior ("run-away" code execution). The Watchdog Timer is external to the main portion of the control system and monitors the operation of the system. This feature is enabled by a falling edge on the WDI pin (after device POR). Monitoring is then done by requiring the embedded controller to force an edge transition (falling or rising) on the WDI pin ("pet the Watchdog") within a predetermined time frame (TWD). If the MCP131X/2X does not detect an edge on the WDI pin within the expected time frame, the MCP131X/2X device will force the Reset pin active. The Watchdog Timer is in the disabled state when: * * * * The Device Powers up A POR event occurred A WDT event occurred A Manual Reset (MR) event occurred Note 1: Figure 4-19 shows a block diagram for using the MCP131X/2X with a PICmicro(R) microcontroller (MCU) and the Watchdog input.
TABLE 4-3:
WATCHDOG TIMER PERIODS (1)
tWDT Typ 6.3 102 1.6 25.6 Max 9.3 153 2.4 38.4 If the time between WDI edges is greater than this, it ensures that the MCP131X/2X always forces a reset Units ms ms sec sec
Min 4.3 71 1.12 17.9 If the time between WDI edges is less than this, it ensures that the MCP131X/2X never forces a reset
When the Watchdog Timer is in the disabled state, the WDI pin has an internal smart pull-up resistor enabled. This pull-up resistor has a typical value of 52 k. This pull-up resistor holds the WDI signal in the high state, until it is forced to another state. After the embedded controller has initialized, if the Watchdog Timer feature is to be used, then the embedded controller can force the WDI pin low (VIL). This also enables the Watchdog Timer feature and disables the WDI pull-up resistor. Disabling the pull-up resistor reduces the device's current consumption. The pull-up resistor will remain disconnected until the device has a power-on, a Reset event occurs, or after the WDT time out. Once the Watchdog Timer has been enabled, the Host Contoller must force an edge transition (falling or rising) on the WDI pin before the minimum Watchdog Timer time out to ensure that the Watchdog Timer does not force the Reset pins (RST/RST) to the active state. If an edge transition does not occur before the maximum time out occurs, then the MCP131X/2X will force the Reset pins to their active state. The MCP131X/2X supports four time outs. The standard offering devices have a typical Watchdog Timer period (TWDT) of 1.6 s. Table 4-3 shows the available Watchdog Timer periods. The tWDT time out is a function of the device voltage and temperature.
Shaded rows are custom ordered Watchdog Timer Periods (tWDT) time outs. For information on ordering devices with these tWDT time outs, please contact your local Microchip sales office. Minimum purchase volumes are required.
+5V MCP13XX 10 k MCLR PICmicro(R) MCU I/O
3-Terminal Regulator (example: MCP1700)
+5V 0.1 F
VCC
RST
WDI GND
FIGURE 4-19:
Watchdog Timer.
The software routine that strobes WDI is critical. The code must be in a section of software that is executed frequently enough so the time between edge transitions is less than the Watchdog time out period. One common technique controls the Host Controllers I/O line from two sections of the program. The software might set the I/O line high while operating in the Foreground mode and set it low while in the Background or Interrupt modes. If both modes do not execute correctly, the Watchdog Timer issues reset pulses.
DS21985A-page 30
(c) 2005 Microchip Technology Inc.
MCP131X/2X
5.0 APPLICATION INFORMATION
5.3
This section shows application related information that may be useful for your particular design requirements.
Using in PICmicro(R) Microcontroller, ICSPTM Applications
This operation can only be done using the device with the Open-Drain RST pin (MCP1320, MCP1321 and MCP1322). Devices that have the internal pull-up resistor are not recommended due to the current path of the internal pull-up resistor.
5.1
Supply Monitor Noise Sensitivity
Note:
The MCP131X/2X devices are optimized for fast response to negative-going changes in VDD. Systems with an inordinate amount of electrical noise on VDD (such as systems using relays) may require a 0.01 F or 0.1 F bypass capacitor to reduce detection sensitivity. This capacitor should be installed as close to the MCP131X/2X as possible to keep the capacitor lead length short.
0.1 F VDD
Figure 5-4 shows the typical application circuit for using the MCP132X for voltage superviory function when the PICmicro microcontroller will be programmed via the In-Circuit Serial ProgrammingTM (ICSPTM) feature. Additional information is available in TB087, "Using Voltage Supervisors with PICmicro(R) Microcontroller Systems which Implement In-Circuit Serial ProgrammingTM", DS91087. Note: It is recommended that the current into the RST pin be current limited by a 1 k resistor.
MCP131X/2X
WDI MR VSS RST RST
VDD/VPP
FIGURE 5-1: Typical Application Circuit with Bypass Capacitor.
0.1 F VDD RPU
VDD PICmicro(R) Microcontroller MCLR Reset input) (Active-Low) VSS
5.2
Conventional Voltage Monitoring
MCP132X
RST VSS 1 k
Figure 5-2 and Figure 5-3 show the MCP131X/2X in conventional voltage monitoring applications.
+ -
VDD
MCP131X/2X
VSS
RST
BATLOW
FIGURE 5-4: Typical Application Circuit for PICmicro(R) Microcontroller with the ICSPTM Feature.
FIGURE 5-2:
Battery Voltage Monitor.
VDD
+ Pwr Sply -
MCP131X/2X
VSS
RST Power Good
FIGURE 5-3:
Power Good Monitor.
(c) 2005 Microchip Technology Inc.
DS21985A-page 31
MCP131X/2X
5.4 Modifying The Trip Point, VTRIP 5.5 MOSFET Low-Drive Protection
Although the MCP131X/2X device has a fixed voltage trip point (VTRIP), it is sometimes necessary to make custom adjustments. This can be accomplished by connecting an external resistor divider to the MCP131X/2X VDD pin. This causes the VSOURCE voltage to be at a higher voltage than when the MCP131X/2X input equals it's VTRIP voltage (Figure 5-5). To maintain detector accuracy, the bleeder current through the divider should be significantly higher than the 10 A maximum operating current required by the MCP131X/2X. A reasonable value for this bleeder current is 1 mA (100 times the 10 A required by the MCP131X/2X). For example, if VTRIP = 2V and the desired trip point is 2.5V, the value of R1 + R2 is 2.5 k (2.5V/1 mA). The value of R1 + R2 can be rounded to the nearest standard value and plugged into the equation of Figure 5-5 to calculate values for R1 and R2. 1% tolerance resistors are recommended. VSOURCE Low operating power and small physical size make the MCP131X/2X series ideal for many voltage detector applications. Figure 5-6 shows a low-voltage gate drive protection circuit that prevents overheating of the logic-level MOSFET due to insufficient gate voltage. When the input signal is below the threshold of the MCP131X/2X, its output grounds the gate of the MOSFET.
VTRIP
270
VDD RL
VDD
MCP131X/2X
VSS
RST
MTP3055EL
R2 VDD
FIGURE 5-6: Protection. MCP131X/2X RST
VSS
MOSFET Low-Drive
5.6
Low-Power Applications
or RST
R1
In some low-power applications, the longer that the microcontroller (such as a PICmicro MCU) can be in the "Sleep mode", the lower the average system current consumption will be. The WDT feature can be used to "wake-up" the PICmicro MCU at a regular interval to service the required tasks before returning to sleep. This "wake-up" occurs after the PICmicro MCU detects a MCLR reset during Sleep mode (for mid-range family; POR = `1', BOR = `1', TO = `1' and PD = `1').
V Where:
------------------x R +1R SOURCE 1 2
R
=V
TRIP
VSOURCE = Voltage to be monitored VTRIP = Threshold Voltage setting Note: In this example, VSOURCE must be greater than (VTRIP)
FIGURE 5-5: Modify Trip-Point using External Resistor Divider.
DS21985A-page 32
(c) 2005 Microchip Technology Inc.
MCP131X/2X
5.7 Controllers and Processors With Bidirectional I/O Pins 5.8 RESET Signal Integrity During Power-Down
Some microcontrollers have bidirectional Reset pins. Depending on the current drive capability of the controller pin, an indeterminate logic level may result if there is a logic conflict. This can be avoided by adding a 4.7 k resistor in series with the output of the MCP131X/2X (Figure 5-7). If there are other components in the system that require a Reset signal, they should be buffered so as not to load the Reset line. If the other components are required to follow the Reset I/O of the microcontroller, the buffer should be connected as shown with the solid line. Buffered Reset To Other System Components
The MCP131X/2X Reset output is valid to VDD = 1.0V. Below this 1.0V, the output becomes an "open circuit" and does not sink or source current. This means CMOS logic inputs to the microcontroller will be floating at an undetermined voltage. Most digital systems are completely shut down well above this voltage. However, in situations where the Reset signal must be maintained valid to VDD = 0V, external circuitry is required. For devices where the Reset signal is active-low, a pull-down resistor must be connected from the MCP131X/2X Reset pin(s) to ground to discharge stray capacitances and hold the output low (Figure 5-8). Similarly for devices where the Reset signal is active-high, a pull-up resistor to VDD is required to ensure a valid high Reset signal for VDD below 1.0V. This resistor value, though not critical, should be chosen such that it does not appreciably load the Reset pin(s) under normal operation (100 k will be suitable for most applications). VDD
Buffer VDD MCP13XX RST GND 4.7 k PICmicro(R) MCU MCLR GND
FIGURE 5-7: Interfacing the MCP131X/2X Push-Pull outputs to a Bidirectional Reset I/O.
VDD MCP13XX RST R1 100 k
GND
FIGURE 5-8: Ensuring a valid active-low Reset pin output state as VDD approaches 0V.
(c) 2005 Microchip Technology Inc.
DS21985A-page 33
MCP131X/2X
6.0 STANDARD DEVICE OFFERINGS 7.0 CUSTOM CONFIGURATIONS
Table 7-2 shows the codes that specify the desired Reset time out (tRST) and Watchdog Timer time out (tWDT) for custom devices The voltage trip point (VTRIP) is specified by the two digits of the desired typical trip point voltage. As an example, if the desired VTRIP selection has a typical VTRIP of 2.7V, the code is 27.
Table 7-1 shows the standard devices that are available and their respective configuration. The configuration includes the: * Voltage Trip Point (VTRIP) * Reset Time Out (tRST) * Watchdog Time Out (tWDT) Table 7-1 also shows the order number for that given device configuration.
TABLE 7-1:
Device MCP1316 MCP1316 MCP1316M MCP1316M MCP1317 MCP1317 MCP1318 MCP1318 MCP1318M MCP1318M MCP1319 MCP1319 MCP1319M MCP1319M MCP1320 MCP1320 MCP1321 MCP1321 MCP1322 MCP1322
STANDARD VERSIONS
Reset Time Out (ms) Reset Threshold (V) Minimum Typical 2.90 4.60 2.90 4.60 2.90 4.60 2.90 4.60 2.90 4.60 2.90 4.60 2.90 4.60 2.90 4.60 2.90 4.60 2.90 4.60 140 140 140 140 140 140 140 140 140 140 140 140 140 140 140 140 140 140 140 140 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 Watchdog Time Out (s) Minimum 1.12 1.12 1.12 1.12 1.12 1.12 1.12 1.12 1.12 1.12 -- -- -- -- 1.12 1.12 1.12 1.12 -- -- Typical 1.6 1.6 1.6 1.6 1.6 1.6 1.6 1.6 1.6 1.6 -- -- -- -- 1.6 1.6 1.6 1.6 -- -- Order Number MCP1316T-29LE/OT MCP1316T-46LE/OT MCP1316MT-29LE/OT MCP1316MT-46LE/OT MCP1317T-29LE/OT MCP1317T-46LE/OT MCP1318T-29LE/OT MCP1318T-46LE/OT MCP1318MT-29LE/OT MCP1318MT-46LE/OT MCP1319T-29LE/OT MCP1319T-46LE/OT MCP1319MT-29LE/OT MCP1319MT-46LE/OT MCP1320T-29LE/OT MCP1320T-46LE/OT MCP1321T-29LE/OT MCP1321T-46LE/OT MCP1322T-29LE/OT MCP1322T-46LE/OT
TABLE 7-2:
Code A B C D E F G H Note 1:
DELAY TIME OUT ORDERING CODES
Typical Delay Time (ms) Comment Note 1 Note 1 Note 1 Note 1 Note 1 Note 1 Note 1 Note 1 Code J K L M N P Q R Reset 200.0 200.0 200.0 200.0 1600.0 1600.0 1600.0 1600.0 WDT 6.3 102.0 1600.0 25600.0 6.3 102.0 1600.0 25600.0 Comment Note 1 Note 1 Delay timings for standard device offerings Note 1 Note 1 Note 1 Note 1 Note 1 WDT 6.3 102.0 1600.0 25600.0 6.3 102.0 1600.0 25600.0
Typical Delay Time (ms) Reset 1.6 1.6 1.6 1.6 30.0 30.0 30.0 30.0
This delay timing combination is not the standard offering. For information on ordering devices with these delay times, contact your local Microchip sales office. Minimum purchase volumes are required.
DS21985A-page 34
(c) 2005 Microchip Technology Inc.
MCP131X/2X
8.0
8.1
DEVELOPMENT TOOLS
Evaluation/Demonstration Boards
TThe SOT-23-5/6 Evaluation Board (VSUPEV2) can be used to evaluate the characteristics of the MCP131X/2X devices. This blank PCB has footprints for: * * * * Pull-up Resistor Pull-down Resistor Loading Capacitor In-line Resistor
There is also a power supply filtering capacitor. For evaluating the MCP131X/2X devices, the selected device should be installed into the Option A footprint.
FIGURE 1: SOT-23-5/6 Voltage Supervisor Evaluation Board (VSUPEV2).
This board may be purchased directly from the Microchip web site at www.microchip.com.
(c) 2005 Microchip Technology Inc.
DS21985A-page 35
MCP131X/2X
9.0
9.1
PACKAGING INFORMATION
Package Marking Information
5-Pin SOT-23
Example:
Part Number MCP1316T-29LE/OT SOT-23 QANN QBNN QCNN QDNN QENN QFNN QGNN QHNN QJNN QKNN QLNN QMNN QPNN QQNN QRNN QSNN QTNN QUNN QVNN QWNN
XXNN
MCP1316MT-29LE/OT MCP1317T-29LE/OT MCP1318T-29LE/OT MCP1318MT-29LE/OT MCP1319T-29LE/OT MCP1319MT-29LE/OT MCP1320T-29LE/OT MCP1321T-29LE/OT MCP1322T-29LE/OT MCP1316T-46LE/OT MCP1316MT-46LE/OT MCP1317T-46LE/OT MCP1318T-46LE/OT MCP1318MT-46LE/OT MCP1319T-46LE/OT MCP1319MT-46LE/OT MCP1320T-46LE/OT MCP1321T-46LE/OT MCP1322T-46LE/OT
QANN
Legend: XX...X Y YY WW NNN
e3
* Note:
Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information.
DS21985A-page 36
(c) 2005 Microchip Technology Inc.
MCP131X/2X
5-Lead Plastic Small Outline Transistor (OT) (SOT-23)
E E1
p B p1 D
n
1
c A A2
Units Dimension Limits Number of Pins Pitch Outside lead pitch (basic) Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom n p p1 A A2 A1 E E1 D L f c B a b
L
A1
INCHES* MIN NOM 5 .038 .075 .035 .035 .000 .102 .059 .110 .014 0 .004 .014 0 0 .046 .043 .003 .110 .064 .116 .018 5 .006 .017 5 5 .057 .051 .006 .118 .069 .122 .022 10 .008 .020 10 10 0.35 0.90 0.90 0.00 2.60 1.50 2.80 0.35 MAX MIN
MILLIMETERS NOM 5 0.95 1.90 1.18 1.10 0.08 2.80 1.63 2.95 0.45 0 0.09 0 0 0.15 0.43 5 5 5 1.45 1.30 0.15 3.00 1.75 3.10 0.55 10 0.20 0.50 10 10 MAX
* Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side. EIAJ Equivalent: SC-74A Revised 09-12-05 Drawing No. C04-091
(c) 2005 Microchip Technology Inc.
DS21985A-page 37
MCP131X/2X
9.2 Product Tape and Reel Specifications
EMBOSSED CARRIER DIMENSIONS (8 MM TAPE ONLY)
Top Cover Tape
FIGURE 9-1:
A0 W
K0
B0 P
TABLE 1:
Case Outline OT
CARRIER TAPE/CAVITY DIMENSIONS
Package Type SOT-23 3L Carrier Dimensions W mm 8 P mm 4 A0 mm 3.2 Cavity Dimensions B0 mm 3.2 K0 mm 1.4 Output Quantity Units 3000 Reel Diameter in mm 180
FIGURE 9-2:
5-LEAD SOT-23 DEVICE TAPE AND REEL SPECIFICATIONS
Device Marking
User Direction of Feed
Pin 1
W, Width of Carrier Tape
Pin 1 P, Pitch Standard Reel Component Orientation Reverse Reel Component Orientation
DS21985A-page 38
(c) 2005 Microchip Technology Inc.
MCP131X/2X
APPENDIX A: REVISION HISTORY
Revision A (November 2005)
* Original Release of this Document.
(c) 2005 Microchip Technology Inc.
DS21985A-page 39
MCP131X/2X
NOTES:
DS21985A-page 40
(c) 2005 Microchip Technology Inc.
MCP131X/2X
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device
X Tape/Reel Option
XX
X
X Range
/
XX
Examples:
a) b) c) d) MCP1316T-29LE/OT: 5-Lead SOT-23-5 MCP1316T-46LE/OT: 5-Lead SOT-23-5 MCP1316MT-29LE/OT:5-Lead SOT-23-5 MCP1316MT-46LE/OT:5-Lead SOT-23-5
Options Options
VTRIP Time Out Temperature Package
Device:
MCP1316T:
MicroPower Voltage Detector (Tape and Reel) MCP1316MT: MicroPower Voltage Detector (Tape and Reel) MCP1317T: MicroPower Voltage Detector (Tape and Reel) MCP1318T: MicroPower Voltage Detector (Tape and Reel) MCP1318MT: MicroPower Voltage Detector (Tape and Reel) MCP1319T: MicroPower Voltage Detector (Tape and Reel) MCP1319MT: MicroPower Voltage Detector (Tape and Reel) MCP1320T: MicroPower Voltage Detector (Tape and Reel) MCP1321T: MicroPower Voltage Detector (Tape and Reel) MCP1322T: MicroPower Voltage Detector (Tape and Reel) = 2.90V = 4.60V = tRST = 200ms (typ), tWDT = 1.6sec (typ) = -40C to +125C (Except for trip points 2.4V and below)
a) b)
MCP1317T-29LE/OT: 5-Lead SOT-23-5 MCP1317T-46LE/OT: 5-Lead SOT-23-5
a) b) c) d)
MCP1318T-29LE/OT: 5-Lead SOT-23-5 MCP1318MT-29LE/OT:5-Lead SOT-23-5 MCP1318T-46LE/OT: 5-Lead SOT-23-5 MCP1318MT-46LE/OT:5-Lead SOT-23-5
a) b) c) d)
MCP1319T-29LE/OT: 5-Lead SOT-23-5 MCP1318MT-29LE/OT:5-Lead SOT-23-5 MCP1319T-46LE/OT: 5-Lead SOT-23-5 MCP1318MT-46LE/OT:5-Lead SOT-23-5
a) b)
MCP1320T-29LE/OT: 5-Lead SOT-23-5 MCP1320T-46LE/OT: 5-Lead SOT-23-5
VTRIP Options: (Note 1) Time Out Options: (Note 1) Temperature Range:
29 46 L
a) b)
MCP1321T-29LE/OT: 5-Lead SOT-23-5 MCP1321T-46LE/OT: 5-Lead SOT-23-5
E
a) b)
MCP1322T-29LE/OT: 5-Lead SOT-23-5 MCP1322T-46LE/OT: 5-Lead SOT-23-5
Package: Note 1:
OT = SOT-23, 5-lead Custom ordered voltage trip points and time outs available. Please contact your local Microchip sales office for additional information. Minimum purchase volumes are required.
(c) 2005 Microchip Technology Inc.
DS21985A-page 41
MCP131X/2X
NOTES:
DS21985A-page 42
(c) 2005 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices: * * * Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable."
* *
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip's products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights.
Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB, PICMASTER, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Linear Active Thermistor, MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance and WiperLock are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2005, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper.
Microchip received ISO/TS-16949:2002 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona and Mountain View, California in October 2003. The Company's quality system processes and procedures are for its PICmicro(R) 8-bit MCUs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified.
(c) 2005 Microchip Technology Inc.
DS21985A-page 43
WORLDWIDE SALES AND SERVICE
AMERICAS
Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://support.microchip.com Web Address: www.microchip.com Atlanta Alpharetta, GA Tel: 770-640-0034 Fax: 770-640-0307 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, MI Tel: 248-538-2250 Fax: 248-538-2260 Kokomo Kokomo, IN Tel: 765-864-8360 Fax: 765-864-8387 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 San Jose Mountain View, CA Tel: 650-215-1444 Fax: 650-961-0286 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509
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EUROPE
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10/31/05
DS21985A-page 44
(c) 2005 Microchip Technology Inc.

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